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For the mounting process the SMD type package can be handled as a standard
surface mount component. The use of either solder or conductive epoxy is possible.
The solder thickness after reflow should be typical 50pm [2 mils] and the lateral
alignment between the package and the motherboard should be within 50pm [2
mils]. Caution should be taken to obtain a good and reliable contact over the whole
pad areas. Voids or other improper connections, in particular, between the ground
pads of motherboard and package will lead to a deterioration of the RF performance
and the heat dissipation. The latter effect can reduce drastically reliability and lifetime
of the product.
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