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Version

Parameter

Symbol


·8

·H

·L

·10
Unit

Note

Row active to row active delay

tRRD(min)
16
20
20
20
ns
1

RAS to CAS delay

tRCD(min)
20
20
20
24
ns
1

Row precharge time
tRP(min)
20
20
20
24
ns
1


tRAS(min)
48
50
50
50
ns
1

Row active time


tRAS(max)

100

us

Row cycle time
tRC(min)
68
70
70
80
ns
1

Last data in to row precharge

tRDL(min)
8
10
10
12
ns
2

Last data in to new col. address delay

tCDL(min)
1
CLK
2

Last data in to burst stop

tBDL(min)
1
CLK
2

Col. address to col. address delay

tCCD(min)
1
CLK
3


Number of valid
CAS latency=3
2


output data



CAS latency=2

1

ea


4


AD50F12KBF   seller 




{
=T__











N


AD50F12KBF   datasheet 

The given load impedance is optimized for output power in saturated mode
(Bluetooth) and does not represent the conjugate complex output impedance of the
device since large signal conditions apply.
AD50F12KBF   price 


Ta=25
Ta=-4085

CHARACTERISTIC

SYMBOL

TEST CONDITION


Vcc

MIN.

TYP.

MAX.

MIN.

MAX.
UNIT


High-Level
Input Voltage


VIH
2.0
4.5

6O
1.7
3.6

4.8
1.7
3.6

4.8

V




Low-Level
Input Voltage


VIL
2.0
4.5

6.0
0.3
0.9

1.2
0.3
0.9

1.2

V





High-Level


VOH

VIN=VIL


IOH= -20pA

2.0
4.5
6.0
1.8
4.0
5.5
2.0
4.5
5.9
1.8
4.0
5.5

V


Output Voltage



VIN=GND


Ioii= -4mA
101-1= -5.2mA

4.5
6.0

4.18
5.68

4.31
5.80

4.13
5.63



Low-Level


VOL

VIN=VIH


IOL=20PA

2.0
4.5
6.0
0.0
0.0
O1
0.2
0.5
0.5
0.2
0.5
0.5

V


Output Voltage



VIN=VCC

IOL=4mA

IOL=5.2mA
4.5

6.0
0.17

0.18
0.26

0.26
0.33

0.33

Input Leakage
Current

IIN

VIN=VCC or GND

6O

±0.1

±1.0

Quiescent
Supply Current

IcC

VIN=VCC or GND

6.0

1.0

10.0
pA


AD50F12KBF   pdf 

co SUPER MINIATURE CASE
co SPECIAL SELECTIONS AVAILABLE
co LOW COST
co SUPERIOR LOT TO LOT CONSISTENCY
co HIGH RELIABILITY
co "C" BEND CONSTRUCTION PROVIDES
STRAIN RELIEF WHEN MOUNTED ON
PC BOARD
co GLASS PASSIVATED CHIP
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