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The RF ports comprise a DC blocking capacitor on chip level. The DC connections
include a first level of DC decoupling capacitors (typically 120pF) in the package.
However, all DC bias ports should be additionally connected to ground with 10nF
capacitors at board level to prevent the MMIC from oscillations. These parts should
be placed close to the SMD leadless package. If the same bias is required at
different DC ports, the lines should only be connected behind these block capacitors.
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