BT9014,Top sales BT9014,BT9014 DATASHEET -ICSTOCK

			Limits
Symbol	Parameter	Condition	Min	Typ.	Max	Unit
IRRM	Repetitive reverse current	VR = VRRM, Tj = 150IC			8	mA
VFM	Forward voltage drop	IF= 20A			1 5	V
RchO-f) (Note 5)	Thermal resistance	Per l/6 module			3 6	IC/W

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Stresses beyond those listed under "Absolute
Maximum Ratings" may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
BT9014 datasheet

PARAMETER	VALUE
Pad Size on PCB	0.275mm
Pad Shape	Round
Pad Definition	Non-Solder Mask defined pads
Solder Mask Opening	0.325mm Round
Solder Stencil Thickness	0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)	0.330mm Round
Solder Flux Ratio	50/50 by volume
Solder Paste Type	No Clean
Pad Protective Finish	OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball	+50lim
Solder Ball Side Coplanarity	+20lim
Maximum Dwell Time Above Liquidous	60 seconds
Soldering Maximum Temperature	2600C
Non-Solder Mask Defined Pad 0.275mm DIA.	Solder Stencil Opening 0.330mm DIA.

BT9014 price

j		llOiIIIRKISeries RthjC (DC) = 0.27 K/W
l	{	N		4l
		j		uction	t\ngle
	\|j	j
			1 90'	>
	3	lo	Io	1200 l	1800 l

BT9014 pdf

Type	VDS	ID	RDS(on)	Package	Marking
BSP 300	800 V	0.19 A	20 l	SOT-223	BSP 300