MC10H173M,Top sales MC10H173M,MC10H173M DATASHEET -ICSTOCK

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			IB=	67r	nA
			- Ti=250C Ti=1250C

MC10H173M seller

Dimensions	Inches	Mimeters
K	O85	21 5
L	O83	21 0
M	0.75	19 0
N	0.71	18 0
P	O69	17 5
Q	O65	16 5
R	O30	7.5
S	0.22 Dia.	Dia. 5.5

MC10H173M datasheet

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MC10H173M price

Description:
Powerex IGBTMODTM Modules are
designed for use in switching
applications. Each module consists
of six IGBT Transistors in a three
phase bridge configuration, with
each transistor having a reverse-
connected super-fast recovery
free-wheel diode. All components
and interconnects are isolated
from the heat sinking baseplate,
offering simplified system assem-
bly and thermal management.
MC10H173M pdf

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