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UT6500/UT5250  Top sales 



Symbol
Value
Unit


Zener Current see Table "Characteristics"


Power Dissipation at Tamb = 25 0C

Ptot

5001)

mW


Junction Temperature

T

175

oc


Storage Temperature Range

Ts

-55 to +175

c


i) Valid provided that leads are kept at ambient temperature at a distance of 8 mm from case


UT6500/UT5250   seller 

Hitachi Asia Ltd.
(Taipei Branch Office)
4/F, No. 167, Tun Hwa North Road
Hung-Kuo Building,
Taipei (105), Taiwan
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
UT6500/UT5250   datasheet 



COMMAND


CKEn-l


CKEn


cs


RAS


CAS


WE


DQM


BAO,1


A10/AP

A12, A11

A9 ~ AO

Note

Register
Mode Register Set
H
x
L
L
L
L
x
OP CODE
1.2

Auto Refresh


H
H


L

L

L

H

x


x

3

Entry
L
3


Refresh

Self

L

H

H

H

x


x

3

Refresh

Exit

L

H


H

x

x

x

3

Bank Active & Row Addr.
H
x
L
L
H
H
x
V
Row Address

Read &
Auto Precharge Disable

x

L

H

L

H

x

V
L
Column
4

Column Address



Auto Precharge Enable

H



H

Address

(AO~A8)

4.5

Write &
Auto Precharge Disable

x

L

H

L

L

x

V
L
Column
4

Column Address



Auto Precharge Enable

H



H

Address

(AO~A8)

4.5

Burst Stop
H
x
L
H
H
L
x
x
6

Bank Selection

x

L

L

H

L

x
V
L

x

Precharge


All Banks
H


x

H

H
x
x
x

x

x


Clock Suspend or

Active Power Down
Entry

H

L


L

V

V

V

Exit
L
H
x
x
x
x
x

H
x
x
x

x

x


Precharge Power Down
Entry

H

L


L

H

H

H

Mode
H
x
x
x

x

Exit

L

H


L

V

V

V

DQM
H
x
V
x
7


No Operation Command

H

x
H
x
X
x

x

x

L
H
H
H


UT6500/UT5250   price 

Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
UT6500/UT5250   pdf 

We recommend the use ofreflow-soldering techniques to solder-mount QFP packages.
Please consult with your Sanyo representative for details on process conditions if the package itself is to be directly
immersed in a dip-soldering bath (dip-soldering techniques).
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