Stock Map: 1   2   3   4   5   6   7   8   9   10   11   12   13   14   15  
1,UWT0G681MNL1GS are hot selling, Following list are globle excellent suppliers of UWT0G681MNL1GS, If you want to purchase UWT0G681MNL1GS, you can contact the suppliers of UWT0G681MNL1GS by email,telephone or leave a message for them.
2,Enter the right button for UWT0G681MNL1GS DATASHEET Download of UWT0G681MNL1GS, free for datasheet of UWT0G681MNL1GS 

UWT0G681MNL1GS,Top sales UWT0G681MNL1GS,UWT0G681MNL1GS DATASHEET

UWT0G681MNL1GS  Top sales 

=
S
Z

0
N
V
0

d
I
A
I
I
-
I
V
I
A


H
i
I
N

1
S
N
V

l
0

Z
I
-
I
V
I
A
l

O
N
UWT0G681MNL1GS   seller 


Total Gate Charge

QG

Vcc = 600V, lc = 300A, VGE = 15V

1500

nC

Emitter-Collector Voltage

VEC

IE = 300A, VGE = OV

3.4

Volts


UWT0G681MNL1GS   datasheet 


CONDITIONS:

Curve VCC3VINO: ViO = 3.OV channel voltage = O.OV
Curve VCC3VIN3: ViO = 3.OV channel voltage = 3.OV
Curve VCC5VINO: Vl0 = 5.5V channel voltage = O.OV
Curve VCC5VIN5: Vl0 = 5.5V channel voltage = 5.5V


UWT0G681MNL1GS   price 

NOTES:
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION Gl, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS O.Ol0
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
5. CONTROLLING DIMENSION:INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP T0 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOTINCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 [0.635).
UWT0G681MNL1GS   pdf 

Description:
Powerex IGBTMODTM Modules
are designed for use in switching
applications. Each module consists
of two IGBT Transistors in a
half-bridge configuration with each
transistor having a reverse-
connected super-fast recovery
free-wheel diode. All components
and interconnects are isolated
from the heat sinking baseplate,
offering simplified system assembly
and thermal management.
©© Copyright:-www.13ic.Com 2000-2010 Message at MSN:search_01@live.com
Service hot :(86)-0755-86525401 Fax:86-755-84521245